The H3TRB system is designed to perform High temp.&High humidity bias burn-in and 85℃&85% burn-in for discrete device such as diode,transistor,FET, IGBT and SCR in various packages.
Test Standard
Product Features
Temp./RH%
Temp. up to 125℃;
RH:98% ;
BIB substrate material: Polyimide
Failure Device Data fetch
Auto-identify failed DUT and continuous fetch last 50-100 data in 10s interval for failure analysis .
Auto-loading Parameter
Auto-apply Temp.Humidity,Voltage and other parm.to the DUT per the software setting.
Real time monitoring
Real-time monitoring of all DUTS' data&over limit status.
Product Parameters
Chamber
Brand
ESPEC GPR-03
Dimension
600*750*800(mm)
Air circulating
Vertical air circulating design(BIB insert vertically)
Temp./Humidity
-20℃~+150℃ / 25~98%RH
Temp. uniformity
125℃±3℃(null load); Fluctuation:±0.5℃
Water supply
Manual / Automatic replenishment
Capacity
Zone
4-8
Slot
16
DUT per slot
40 / 80 (option)
Total
640 / 1280 (option)
Power Supply
QTY.
4-8sets
Output
Max1000V
Driver Board
QTY.
16pcs
Voltage detection range
0.0V~1000.0V;Resolution:1V;Accuracy:±(1%+1LSB)
Leakage current detection range
0.0uA~50.0mA;Resolution:0.1uA;Accuracy:±(1%+1LSB)
Protection
Relay protection/Fuse protection
Burn-in Board
Substrate material
Dedicated BIB for H3TRB; Resist to150℃;Conformal coating to meet>2 years service life at high temp.&humidity condition.
Socket
High temperature resistant, anti-oxidation and fatigue resistant materials