The BTR E600 series burn-in system is designed to perform HTRB,HTGB & HTIR burn-in for Semiconductor Discrete Device including diode,transistor, FET,IGBT module and SCR in various packages.
Test Standard
Product Features
Max Test Temp.
Chamber & BIB: 150℃ / 175℃ / 200℃ are optional
Failure Device Data fetch
Auto-identify failed DUT and fetch last 50-100 data in 10s interval for failure analysis.
Auto-loading Parameter
Auto-apply Temp. Voltage and other parm. to the DUT according to the software setting.
Real time monitoring
Real-time monitoring of all DUTS' test parameter&over limit status.