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BTR-E670L(16 slots/Split-body)
H3TRB Burn-in System-Standard type

The H3TRB system is designed to perform High temp.&High humidity bias burn-in and 85℃&85% burn-in for discrete device such as diode,transistor,FET, IGBT and SCR in various packages.

试验标准
产品特点
产品参数
Chamber
Brand
ESPEC GPR-03
Dimension
600*750*800(mm)
Air circulating
Vertical air circulating design(BIB insert vertically)
Temp./Humidity
-20℃～+150℃ / 25～98%RH
Temp. uniformity
125℃±3℃(null load); Fluctuation:±0.5℃
Water supply
Manual / Automatic replenishment
Capacity
Zone
4-8
Slot
16
DUT per slot
40 / 80 （option）
Total
640 / 1280 （option）
Power Supply
QTY.
4-8sets
Output
Max1000V
Driver Board
QTY.
16pcs
Voltage detection range
0.0V~1000.0V;Resolution:1V;Accuracy:±(1%+1LSB)
Leakage current detection range
0.0uA~50.0mA;Resolution:0.1uA;Accuracy:±(1%+1LSB)
Protection
Relay protection/Fuse protection
Burn-in Board
Substrate material
Dedicated BIB for H3TRB; Resist to150℃;Conformal coating to meet＞2 years service life at high temp.&humidity condition.
Socket
High temperature resistant, anti-oxidation and fatigue resistant materials
Dimension
290*600(mm)
Equipment
Dimension
1430W*1400D*2000H(mm)
Electrical requirement
A.C.220V±10%/50Hz
Power/Weight
8KW/600KG
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